CES LAS VEGAS 2027January 6 to 9, 2027
The Precogs, startup profile

Frore Systems

A 2.8 mm chip that replaces the fan, now joined by GPU cold plates

United States, San Jose, California (United States)Computer Hardware & ComponentsÀ confirmer, booth À confirmerCES 2027 : Not confirmed yet (exhibited at CES 2023 through 2026)

Prepared with AI agents, reviewed by Matt.

Company profile

Founded in2018 (started in a Los Altos garage, per the founder's YesPress profile)
FoundersSeshu Madhavapeddy (CEO) and Surya P. Ganti (CTO), both Qualcomm alumni. Madhavapeddy held VP/GM roles at Qualcomm (mobile computing, in-display fingerprint sensors, IoT), following stints at Samsung Mobile and Texas Instruments and two startup exits (Spatial Wireless to Alcatel-Lucent, Sipera to Avaya).
StageScale-up, unicorn since its March 2026 Series D
FundingAbout $340 million raised in total. $100 million in December 2022 (Qualcomm Ventures, Mayfield, Addition, Clear Ventures; $116 million cumulative). $80 million Series C in May 2024 led by Fidelity, with Prosperity7, Mayfield, Clear Ventures, Addition, Qualcomm Ventures, MVP Ventures, StepStone and Alumni Ventures ($196 million cumulative). $143 million Series D in March 2026 led by MVP Ventures, with Fidelity, Top Tier, Mayfield and Qualcomm Ventures, at a $1.64 billion valuation.
Team sizeNot disclosed
Websitehttps://www.froresystems.com/ ↗
LinkedInhttps://www.linkedin.com/company/froresystems/ ↗

The problem

Thin laptops, tablets, mini PCs, SSDs and edge AI modules have no room for a fan, so their processors throttle as soon as they heat up. In 2022 Frore claimed it could double laptop performance by removing that throttling. At the other end, data center GPUs keep climbing: 1,400 W for Blackwell Ultra, 1,950 W for Rubin, and roughly 4,400 W projected for the Feynman generation around 2029.

The solution

AirJet is a solid-state active cooling chip. The original AirJet Mini measures 27.5 x 41.5 x 2.8 mm, weighs 11 g and removes 5 W; the AirJet Pro, equally thin, removes 10 W. The second-generation AirJet Mini G2 reaches 7.5 W per chip at 2.65 mm. For data centers, the LiquidJet line offers direct liquid cooling cold plates, including LiquidJet Nexus for NVIDIA Kyber compute trays.

How it works

  1. A heat spreader draws heat from the processor into the AirJet chip mounted on top of it.
  2. Tiny membranes vibrate at ultrasonic frequencies, pulling air in through top vents and pushing it out one side as high-velocity pulsating jets.
  3. Back pressure reaches 1,750 Pa versus about 195 Pa for a laptop fan, enough to push air through 1 mm gaps or dust and water filters.
  4. The AirJet Mini draws about 1 W and the company quotes 21 dBA against roughly 42 dBA for a typical fan; chips can be ganged into AirJet PAK modules (up to 45 W for the PAK 5C-G2, about 1 cm thick, IP65).
  5. In the data center, LiquidJet swaps the flat cold plate for 3D jet microchannels built with wafer-level processes and aligned with GPU hotspots.

AirJet Mini G2 at Computex 2025

Walkthrough of the 7.5 W second-generation chip and its use in laptops.

Value proposition

For OEMs, the company pitches a part that drops into the bill of materials with no fan or custom tooling, letting designers keep a sealed, waterproof (the AirJet Mini Sport passed IP68 testing at over 1.5 m) and quiet chassis without throttling. For LiquidJet, Frore claims GPUs running about 8°C cooler, about 4% more token throughput, roughly 10% lower PUE and 55% lighter cold plates (company figures).

Technology edge

Unlike a fan, AirJet has no blades or bearings, fits in 2.65 to 2.8 mm and generates about nine times the back pressure of a laptop fan (1,750 Pa vs 195 Pa). Against xMEMS µCooling, smaller but capped at 1,000 Pa, Frore targets higher power (up to 45 W per module) and carries the same microjet know-how into the data center. The company says LiquidJet is designed for GPUs above 4,400 W and cuts junction temperature by up to 7.7°C.

Business model

B2B sales of components and modules to device makers (AirJet, AirJet PAK, SnowGoose development kit) and of cold plates and systems to server builders (LiquidJet). Unit pricing not disclosed. Manufacturing is outsourced in Taiwan; the stated 2026 target is 5 million AirJet chips and 500,000 LiquidJet cold plates.

Market

Dell'Oro Group (January 2026) expected data center liquid cooling revenue to roughly double to nearly $3 billion in 2025 and reach about $7 billion by 2029, driven mainly by single-phase direct liquid cooling. Frore targets that segment with LiquidJet while keeping its thin-device and edge AI business with AirJet.

Competitors and alternatives

Conventional fans and heat pipes remain the cheap default: TechRadar noted in 2024 that a Minisforum mini PC with a comparable chip cost $250, versus $599 for the AirJet-equipped Zotac. xMEMS sells its µCooling XMC-2400 fan-on-a-chip, far smaller (9.26 x 7.6 x 1.08 mm, 1,000 Pa), expected in mobile devices in 2026 and also pitched for SSDs and smart glasses. In data centers, JetCool (acquired by Flex in November 2024) sells microconvective cold plates and CDUs rated up to 300 kW per rack; established cold plate and CDU suppliers compete in the same slot.

Use cases

  • Zotac has sold the ZBOX Pico PI430AJ mini PC (Intel Core i3-N300) since 2023, cooled by two AirJet chips and priced at $599 for the US Windows edition.
  • Iodyne launched the Pro Mini in September 2024, a 4 or 8 TB Thunderbolt external SSD ($1,500 and $2,200) cooled by AirJet and rated under 24 dBA.
  • Phison demonstrated in 2023 a PCIe Gen5 SSD with an E26 controller cooled by two AirJet Minis, with no throttling.
  • Intel showed an 11.3 mm Wildcat Lake reference laptop cooled by an AirJet Mini at Computex 2026, with no retail model announced.

Traction and proof points

Intel Evo laptop partnership announced December 2022; Zotac ZBOX Pico PI430AJ (2023); Phison demo at Flash Memory Summit (August 2023); SmartCow named as an early AirJet PAK adopter (May 2024); Iodyne Pro Mini SSD (2024); proof-of-concept builds on the Samsung Galaxy Book4 Edge and iPad Pro. Memorandum of understanding with Taiwan's Asia Optical (April 2026) to build LiquidJet products at a plant in the Philippines. CES Innovation Awards: Best of Innovation 2024 (AirJet Mini, Embedded Technologies), Honoree 2025 (AirJet Mini Sport) and Honoree 2026. Exhibited at CES 2023 through 2026 (2026: Venetian, Veronese room, booth 2401A-B), where LiquidJet was shown.

What remains to be proven

Almost four years after the Intel announcement, no mainstream laptop shipping with AirJet is named in the sources reviewed, and shipped products remain niche (mini PCs, SSDs, Jetson modules); TechRadar found the Zotac overpriced. In data centers, Frore declines to name customers and its claimed gains (8°C, 4% more tokens, 10% PUE) lack independent validation. It still has to show it can hit 500,000 LiquidJet cold plates in 2026 against entrenched suppliers.

Why you should not miss it at CES

Ask which retail laptops or tablets ship with the AirJet Mini G2 in 2027, with noise and skin temperature figures under load. On LiquidJet, ask for at least one named cloud or server customer, actual shipped volumes and third-party test data on Rubin GPUs.

Why it matters

Frore shows a consumer electronics startup pivoting into AI infrastructure: the same semiconductor-style microfluidics serves both a chip under 3 mm thick and a cold plate for multi-kilowatt GPUs. Its unicorn valuation, set in March 2026, is a bet that cooling is becoming the bottleneck of compute. The open question is whether demos and awards turn into named volume, in PCs and in racks alike.

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Sources

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